LPM 2014 Special Sessions:


SS1: Liquid-assisted laser micro- and nanofabrication

Session Organizers: Stephan Barcikowski (University of Duisburg-Essen, Technical Chemistry and Center for Nanointegration Duisburg-Essen CENIDE, Germany), Michel Meunier (Ecole Polytechnique de Montreal, Canada)

Lasers offer clear advantages for processing various types of materials on the nanoscale, in particular when liquids are applied to confine delivered energy, to initiate and control surface reactions, or collect nanomaterials. Nanoparticles and nanostructures generated by laser ablation of a solid in a liquid show unique properties in its structures, purity and stability. Laser microstructuring may be amplified by liquid films, and liquid-assisted laser machining such as laser etching is applied in semiconductor and metal structuring. Laser nanostructuring based on near field approaches is carried out on surfaces, in liquids and in biological cells and tissues. Special focus is given on the fabrication of nanoparticles by lasers in liquids and applications of these nanomaterials and nanostructures in nanoplasmonics, metamaterials, energy application, and biomedicine. Original papers are solicited showing progresses in the basic understanding and technology development of liquid-assisted laser fabrication processes and their applications in various fields such as micromachining, micro- and nanostructuring, nanophotonics, nanoelectronics, and biomedicine.


SS2: Laser in photovoltaics

Session Organizers: Arnold Gillner (Fraunhofer ILT, Aachen, Germany); Klaus Zimmer (Leibniz Institute for Surface Modification, Leipzig, Germany); Carlos Molpeceres (Universidad Politecnica de Madrid, Spain)

Laser processing can contribute to enhance the efficiency, the reliability and the production economics to reach grit parity of photovoltaic generator and guarantee the sustainability of the energy supply for the future. Micro- and nanopatterning of surfaces and thin films by laser radiation provides clear advantages for increasing the solar cells efficiency due to increased light absorption or reduced carrier losses, for reducing the interconnection losses for modules fabrication as well as for increasing fabrication process reliability and speed. All aspect related the basic understanding, the technological development and the facilities for laser processing and laser process diagnostics of thin film and silicon photovoltaics will be covered. Special focus is on high speed laser processing, low defect patterning and in process monitoring of thin film ablation, laser scribing or contact formation. Original innovative contributions in these fields related to all topics of laser interaction with materials, laser process optimization and new technological approaches will be addressed. Topics for this special session include but not limited to: laser cutting of wafers, drilling and texturing; laser ablation of dielectric layers; laser edge isolation; monolithic interconnection formation by laser; laser-assisted selective emitter formation; laser doping for high-efficiency solar cells; laser fired contacts; laser metallization for PV devices; laser processes in organics PV; laser annealing for PV applications; laser welding/soldering of cell and module components.

SS3: Laser processing of glass: cutting, drilling, welding

Session Organizer: Kristian Cvecek (Bayerisches Laserzentrum GmbH, Germany)

Glass is a very versatile material due to its excellent physical and chemical properties such as transparency, high softening and melting points or its stability against chemically aggressive environments. Due to these properties it is widely used in optics, telecommunications, electronics, MEMS, biomedicine as well as construction industry and design. In order to be of use for most applications the glass has to be processed prior to its utilization. The processing may consist of cutting, drilling or welding or may even combine these methods. However, while on the one hand the properties of glass make it highly suitable for a large number of applications on the other hand the same properties make glass processing difficult, especially considering laser processing and the transparency of glass. Even so, methods have been established that make fast and effective laser based processing of glass possible by exploiting linear absorption as is the case in glass cutting by CO2-laser or glass drilling by excimer laser. Moreover, the availability of ultra-short pulsed lasers with high pulse energies has made fundamentally new approaches to laser processing of glass possible, where effects such as nonlinear absorption or nonlinear self focusing are exploited. A possible example for the former is glass welding using ultra short laser pulses.

This special session is dedicated to laser based cutting, drilling and welding of glass and the respective emerging technologies. The covered topics encompass new developments in these fields as well as state of the art industrial applications independently of the utilized laser type, the physical mechanism exploited for processing or the specific type of the processed glass. Also, contributions in this session will span laser based glass processing from microscopic to large scale applications.